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1

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Brunschwiler, Thomas, Schlottig, Gerd, Ni, Songbo, Liu, Yu, Goicochea, Javier V., Zürcher, Jonas, Wolf, Heiko

Journal:

Journal of Electronic Packaging

Year:

2014

Language:

english

File:

PDF, 7.25 MB

english, 2014

2

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Brunschwiler, Thomas, Schlottig, Gerd, Ni, Songbo, Liu, Yu, Goicochea, Javier V., Zürcher, Jonas, Wolf, Heiko

Year:

2013

Language:

english

File:

PDF, 3.37 MB

english, 2013

3

[IEEE 2009 IEEE Vehicular Technology Conference (VTC 2009-Fall) - Anchorage, AK, USA (2009.09.20-2009.09.23)] 2009 IEEE 70th Vehicular Technology Conference Fall - Establishing Fracture Properties of EMC-Copper (-Oxide) Interfaces: Test Procedures and Simulations for Establishing the Interface Toughness, Depending on Temperature, Humidity and Mode Mixity

Ernst, L. J., Xiao, A., De Vreugd, J., Jansen, K. M. B., Pape, H., Schlottig, G., Wunderle, B.

Year:

2009

Language:

english

File:

PDF, 2.22 MB

english, 2009

4

Benchmarking Study on the Thermal Management Landscape for Three-Dimensional Integrated Circuits: From Back-Side to Volumetric Heat Removal

Brunschwiler, Thomas, Sridhar, Arvind, Lee Ong, Chin, Schlottig, Gerd

Journal:

Journal of Electronic Packaging

Year:

2016

Language:

english

File:

PDF, 2.85 MB

english, 2016

5

Characterization of modified glassy carbon films

Falko Schlottig, Joachim Schreckenbach, Klaus Witke, Günter Marx

Journal:

Microchimica Acta

Year:

1997

Language:

english

File:

PDF, 662 KB

english, 1997

6

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Establishing mixed mode fracture properties of EMC-Copper (-oxide) interfaces at various temperatures

Xiao, A., Schlottig, G., Pape, H., Wunderle, B., van der Sluis, O., Jansen, K. M. B., Ernst, L. J.

Year:

2009

Language:

english

File:

PDF, 795 KB

english, 2009

7

Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability

Schlottig, Gerd, de Fazio, Marco, Escher, Werner, Granatieri, Paola, Khanna, Vijayeshwar D., Brunschwiler, Thomas

Journal:

Journal of Electronic Packaging

Year:

2016

Language:

english

File:

PDF, 1.88 MB

english, 2016

8

Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]

Brunschwiler, Thomas, Zürcher, Jonas, Del Carro, Luca, Schlottig, Gerd, Burg, Brian, Zimmermann, Severin, Zschenderlein, Uwe, Wunderle, Bernhard, Schindler-Saefkow, Florian, Stässle, Rahel

Journal:

Journal of Electronic Packaging

Year:

2017

File:

PDF, 23 KB

2017

9

[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels

Brunschwiler, Thomas, Steller, Wolfram, Oppermann, Hermann, Kleff, Jessica, Robertson, Stephen, Mrosko, Raul, Keller, Jurgen, Schlottig, Gerd

Year:

2018

Language:

english

File:

PDF, 10.08 MB

english, 2018

10

Mechanical anchorage and peri-implant bone formation of surface-modified zirconia in minipigs

Henning Schliephake, Thomas Hefti, Falko Schlottig, Philippe Gédet, Henning Staedt

Journal:

Journal of Clinical Periodontology

Year:

2010

Language:

english

File:

PDF, 2.86 MB

english, 2010

11

Response of Osteoclasts to Titanium Surfaces with Increasing Surface Roughness: An In Vitro Study

Jenny Brinkmann, Thomas Hefti, Falko Schlottig, Nicholas D. Spencer, Heike Hall

Journal:

Year:

2012

Language:

english

File:

PDF, 777 KB

english, 2012

12

Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks

Brunschwiler, Thomas, Zürcher, Jonas, Del Carro, Luca, Schlottig, Gerd, Burg, Brian, Zimmermann, Severin, Zschenderlein, Uwe, Wunderle, Bernhard, Schindler-Saefkow, Florian, Stässle, Rahel

Journal:

Journal of Electronic Packaging

Year:

2016

Language:

english

File:

PDF, 4.82 MB

english, 2016

13

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 1: Thermal Management - Benchmarking Study on the Thermal Management Landscape for 3D ICs: From Back-Side to Volumetric Heat Removal

Brunschwiler, Thomas, Sridhar, Arvind, Ong, Chin Lee, Schlottig, Gerd

Year:

2015

Language:

english

File:

PDF, 3.47 MB

english, 2015

14

Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill

Straessle, Rahel, Zimmermann, Severin, del Carro, Luca, Zurcher, Jonas, Schlottig, Gerd, Achen, Albert, Hong, Guo, Poulikakos, Dimos, Brunschwiler, Thomas

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 2.25 MB

english, 2018

15

[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Dual-side heat removal by micro-channel cold plate and silicon-interposer with embedded fluid channels

Brunschwiler, Thomas, Mrossko, Raul, Keller, Jurgen, Ozsun, Ozgur, Schlottig, Gerd

Year:

2016

Language:

english

File:

PDF, 1.15 MB

english, 2016

16

A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: An experimental study

Sharma, Chander Shekhar, Schlottig, Gerd, Brunschwiler, Thomas, Tiwari, Manish K., Michel, Bruno, Poulikakos, Dimos

Journal:

International Journal of Heat and Mass Transfer

Year:

2015

Language:

english

File:

PDF, 3.15 MB

english, 2015

17

Systemic sclerostin antibody treatment increases osseointegration and biomechanical competence of zoledronic-acid-coated dental implants in a rat osteoporosis model

Korn, P, Kramer, I, Schlottig, F, Tödtmann, N, Eckelt, U, Bürki, A, Ferguson, SJ, Kautz, A, Schnabelrauch, M, Range, U, Kneissel, M, Stadlinger, B

Journal:

European Cells and Materials

Year:

2019

Language:

english

File:

PDF, 3.73 MB

english, 2019

18

Synergistic interactions of blood-borne immune cells, fibroblasts and extracellular matrix drive repair in an in vitro peri-implant wound healing model

Burkhardt, Melanie A, Waser, Jasmin, Milleret, Vincent, Gerber, Isabel, Emmert, Maximilian Y, Foolen, Jasper, Hoerstrup, Simon P, Schlottig, Falko, Vogel, Viola

Journal:

Scientific Reports

Year:

2016

Language:

english

File:

PDF, 3.32 MB

english, 2016

19

Evaluation of local cancellous bone amelioration by poly- l - dl -lactide copolymers to improve primary stability of dental implants: a biomechanical study in sheep

Stübinger, Stefan, Waser, Jasmin, Hefti, Thomas, Drechsler, Anika, Sidler, Michéle, Klein, Karina, von Rechenberg, Brigitte, Schlottig, Falko

Journal:

Clinical Oral Implants Research

Year:

2015

Language:

english

File:

PDF, 602 KB

english, 2015

20

[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Advances in percolated thermal underfill (PTU) simulations for 3D-integration

Kumar, S. G., Zschenderlein, U., Pantou, R., Brunschwiler, T., Schlottig, G., Schindler-Saefkow, F., Wunderle, B.

Year:

2015

Language:

english

File:

PDF, 1.58 MB

english, 2015

21

[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K

Brunschwiler, Thomas, Zurcher, Jonas, Zimmermann, Severin, Burg, Brian R., Schlottig, Gerd, Xi Chen,, Sinha, Tuhin, Baum, Mario, Hofmann, Christian, Pantou, Remi, Achen, Albert, Zschenderlein, Uwe, K

Year:

2016

Language:

english

File:

PDF, 2.29 MB

english, 2016

22

[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden, Germany (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Microfluidic Interposer for High Performance Fluidic Chip Cooling

Steller, Wolfram, Windrich, Frank, Bremner, Douglas, Robertson, Stephen, Mrosko, Raul, Keller, Jurgen, Brunschwiler, Thomas, Schlottig, Gerd, Oppermann, Hermann, Wolf, M. Jurgen, Lang, Klaus-Dieter

Year:

2018

Language:

english

File:

PDF, 931 KB

english, 2018

23

Ultrasound melted polymer sleeve for improved screw anchorage in trabecular bone—A novel screw augmentation technique

Schmoelz, W., Mayr, R., Schlottig, F., Ivanovic, N., Hörmann, R., Goldhahn, J.

Journal:

Clinical Biomechanics

Year:

2016

Language:

english

File:

PDF, 730 KB

english, 2016

24

Study of moisture transport in silicone gel for IGBT modules

Zhang, K., Schlottig, G., Mengotti, E., Quittard, O., Iannuzzo, F.

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 1.18 MB

2020

25

How is wettability of titanium surfaces influenced by their preparation and storage conditions?

D. Scharnweber, F. Schlottig, S. Oswald, K. Becker, H. Worch

Journal:

Journal of Materials Science: Materials in Medicine

Year:

2010

Language:

english

File:

PDF, 654 KB

english, 2010

26

Histological and histomorphometric evaluation of immediate implant placement on a dog model with a new implant surface treatment

J. L. Calvo-Guirado, A. J. Ortiz-Ruiz, B. Negri, L. López-Marí, C. Rodriguez-Barba, F. Schlottig

Journal:

Clinical Oral Implants Research

Year:

2010

Language:

english

File:

PDF, 2.19 MB

english, 2010

27

Template Synthesis of SiO2 Nanostructures

F. Schlottig, M. Textor, U. Georgi, G. Roewer

Journal:

Journal of Materials Science Letters

Year:

1999

Language:

english

File:

PDF, 98 KB

english, 1999

28

Comparison of chemically and pharmaceutically modified titanium and zirconia implant surfaces in dentistry: a study in sheep

J.D. Langhoff, K. Voelter, D. Scharnweber, M. Schnabelrauch, F. Schlottig, T. Hefti, K. Kalchofner, K. Nuss, B. von Rechenberg

Journal:

International Journal of Oral & Maxillofacial Surgery

Year:

2008

Language:

english

File:

PDF, 3.38 MB

english, 2008

29

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Sequentially formed underfills: Thermo-mechanical properties of underfills at full filler percolation

Schlottig, Gerd, Schindler-Saefkow, Florian, Zurcher, Jonas, Michel, Bruno, Brunschwiler, Thomas

Year:

2013

Language:

english

File:

PDF, 432 KB

english, 2013

30

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Induced delamination of silicon-molding compound interfaces

Schlottig, Gerd, Pape, Heinz, Wunderle, Bernhard, Ernst, Leo J.

Year:

2009

Language:

english

File:

PDF, 564 KB

english, 2009

31

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Delamination and combined compound cracking of EMC-copper interfaces

Xiao, A., Schlottig, G., Pape, H., Wunderle, B., Jansen, K M. B., Ernst, L. J.

Year:

2010

Language:

english

File:

PDF, 1.06 MB

english, 2010

32

Preparation and Microstructure Characterization of Anodic Spark Deposited Barium Titanate Conversion Layers

Schreckenbach, J., Schlottig, F., Marx, G., Kriven, W. M., Popoola, O. O., Jilavi, M. H., Brown, S. D.

Journal:

Journal of Materials Research

Year:

1999

Language:

english

File:

PDF, 362 KB

english, 1999

33

Clot-entrapped blood cells in synergy with human mesenchymal stem cells create a pro-angiogenic healing response

Burkhardt, Melanie A., Gerber, Isabel, Moshfegh, Cameron, Lucas, Miriam S., Waser, Jasmin, Emmert, Maximilian Y., Hoerstrup, Simon P., Schlottig, Falko, Vogel, Viola

Journal:

Biomaterials Science

Year:

2017

Language:

english

File:

PDF, 9.36 MB

english, 2017

34

Ligature-Induced Peri-Implantitis in Minipigs Revisited

Stubinger, Stefan, Bucher, Ramon, Kronen, Peter, Schlottig, Falko, Rechenberg, Brigitte von

Journal:

Periodontics and Prosthodontics

Year:

2016

File:

PDF, 465 KB

2016

35

Electrochemical preparation and surface properties of gold nanowire arrays formed by the template technique

P. Forrer, F. Schlottig, H. Siegenthaler, M. Textor

Journal:

Journal of Applied Electrochemistry

Year:

2000

Language:

english

File:

PDF, 248 KB

english, 2000

36

(Invited) Wafer-Level Integration of Embedded Cooling Approaches

Paredes, S., Madhour, Y., Schlottig, G., Ong, C. L., Brunschwiler, T.

Journal:

ECS Transactions

Year:

2014

Language:

english

File:

PDF, 595 KB

english, 2014

37

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Fracture toughness of Cu-EMC interfaces under pressure cooker conditions

Sadeghinia, M., Jansen, K.M.B., Ernst, L.J., Schlottig, G., Pape, H.

Year:

2011

Language:

english

File:

PDF, 1.61 MB

english, 2011

38

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering

Zurcher, Jonas, Carro, Luca Del, Schlottig, Gerd, Wright, Daniel Nilsen, Vardoy, Astrid-Sofie B., Taklo, Maaike M. Visser, Mills, Tobias, Zschenderlein, Uwe, Wunderle, Bernhard, Brunschwiler, Thomas

Year:

2016

Language:

english

File:

PDF, 2.70 MB

english, 2016

39

Electron microscopic characterization of SrTiO3 films obtained by anodic spark deposition

F. Schlottig, D. Dietrich, J. Schreckenbach, G. Marx

Journal:

Analytical and Bioanalytical Chemistry

Year:

1997

Language:

english

File:

PDF, 693 KB

english, 1997

40

Characterization of anodic spark-converted titanium surfaces for biomedical applications

J. P. Schreckenbach, G. Marx, F. Schlottig, M. Textor, N. D. Spencer

Journal:

Journal of Materials Science: Materials in Medicine

Year:

1999

Language:

english

File:

PDF, 142 KB

english, 1999

41

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Delamination toughness of Cu-EMC interfaces at harsh environment

Sadeghinia, M., Jansen, K. M. B., Ernst, L. J., Schlottig, G., Pape, H.

Year:

2011

Language:

english

File:

PDF, 696 KB

english, 2011

42

Preparation of superhydrophilic microrough titanium implant surfaces by alkali treatment

Stefano Tugulu, Konrad Löwe, Dieter Scharnweber, Falko Schlottig

Journal:

Journal of Materials Science: Materials in Medicine

Year:

2010

Language:

english

File:

PDF, 941 KB

english, 2010

43

[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Implementation

Brunschwiler, Thomas, Tick, Timo, Castriotta, Michele, Schlottig, Gerd, Gschwend, Dominic, Sato, Ken, Nakajima, Takashi, Li, Shidong, Oggioni, Stefano

Year:

2014

Language:

english

File:

PDF, 2.00 MB

english, 2014

44

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays - Lid-Integral Cold Plate Topology Integration, Performance, and Reliability

Schlottig, Gerd, de Fazio, Marco, Escher, Werner, Granatieri, Paola, Khanna, Vijayeshwar D., Brunschwiler, Thomas

Year:

2015

Language:

english

File:

PDF, 8.41 MB

english, 2015

45

Response of human bone marrow stromal cells, MG-63, and SaOS-2 to titanium-based dental implant surfaces with different topography and surface energy

Ute Hempel, Thomas Hefti, Peter Dieter, Falko Schlottig

Journal:

Clinical Oral Implants Research

Year:

2012

Language:

english

File:

PDF, 526 KB

english, 2012

46

Response of osteoblast-like SAOS-2 cells to zirconia ceramics with different surface topographies

Ute Hempel, Thomas Hefti, Marie Kalbacova, Cornelia Wolf-Brandstetter, Peter Dieter, Falko Schlottig

Journal:

Clinical Oral Implants Research

Year:

2010

Language:

english

File:

PDF, 1.09 MB

english, 2010

47

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Establishing the critical fracture properties of the die backside-to-molding compound interface

Schlottig, G., Pape, H., Wunderle, B., Ernst, L. J.

Year:

2011

Language:

english

File:

PDF, 2.39 MB

english, 2011

48

Biomechanical evaluation of a titanium implant surface conditioned by a hydroxide ion solution

Bernd Stadlinger, Stephen J. Ferguson, Uwe Eckelt, Roland Mai, Anna Theresa Lode, Richard Loukota, Falko Schlottig

Journal:

British Journal of Oral and Maxillofacial Surgery

Year:

2012

Language:

english

File:

PDF, 449 KB

english, 2012

49

Influence of additives on properties of sol–gel layers

U. Georgi, F. Schlottig, H. Graebner, L. van Steensel, G. Wolf, G. Roewer

Journal:

Journal of Non-Crystalline Solids

Year:

2000

Language:

english

File:

PDF, 518 KB

english, 2000

50

Benzyl- und Phenäthyl-bleiverbindungen

Erich Krause, Otto Schlöttig

Journal:

European Journal of Inorganic Chemistry

Year:

1930

Language:

german

File:

PDF, 504 KB

german, 1930

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